微软表示，关于此次新硬件及相关更新的更多技术细节，可在官方 Windows 博客的最新公告中进一步了解：
Of course, the size increases with each attached module. However, snapping on the power bank module makes the thickness comparable to a standard modern smartphone. Another key feature here is how these various modular components stick together. Tecno has developed new interconnection technology that uses both magnets and pin connectors. This should make it easy to both attach and remove components.。业内人士推荐heLLoword翻译官方下载作为进阶阅读
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